Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840287 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chia-Chieh Lin, Shu-Ting Tsai +4 more | 2020-11-17 |
| 10535568 | Method for manufacturing multi-voltage devices using high-K-metal-gate (HKMG) technology | Chii-Ming Wu, Cheng-Yuan Tsai, Yi-Huan Chen | 2020-01-14 |