Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861899 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2020-12-08 |
| 10847560 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Hsiu-Yu Cheng | 2020-11-24 |
| 10840287 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2020-11-17 |
| 10818720 | Stacked image sensor having a barrier layer | U-Ting Chen, Cheng-Ying Ho, Tzu-Hsuan Hsu, Shih Pei Chou | 2020-10-27 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2020-09-01 |
| 10682523 | Interconnect structure and method of forming same | Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-16 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2020-01-14 |
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu +1 more | 2020-01-14 |