Issued Patents 2020
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879297 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Chun-Chieh Chuang, Jeng-Shyan Lin | 2020-12-29 |
| 10861899 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-12-08 |
| 10861894 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yen-Ting Chiang +2 more | 2020-12-08 |
| 10825853 | Semiconductor image sensor device with deep trench isolations and method for manufacturing the same | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Sheng-Chan Li, Yu-Jen Wang +3 more | 2020-11-03 |
| 10811398 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Ching-Chun Wang | 2020-10-20 |
| 10804155 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Min-Feng Kao | 2020-10-13 |
| 10797091 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Chi Hung, Feng-Jia Shiu +5 more | 2020-10-06 |
| 10790265 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Dun-Nian Yaung, Jeng-Shyan Lin, Hsun-Ying Huang | 2020-09-29 |
| 10790327 | Semiconductor device structure with a conductive feature passing through a passivation layer | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2020-09-29 |
| 10790194 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Min-Feng Kao | 2020-09-29 |
| 10777590 | Method for forming image sensor device structure with doping layer in light-sensing region | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Yu-Jen Wang, Shyh-Fann Ting +2 more | 2020-09-15 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou +2 more | 2020-09-01 |
| 10734423 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2020-08-04 |
| 10734428 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Feng-Chi Hung, Dun-Nian Yaung | 2020-08-04 |
| 10727265 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yen-Ting Chiang +2 more | 2020-07-28 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Min-Feng Kao +3 more | 2020-07-28 |
| 10727164 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Ching-Chun Wang, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2020-07-28 |
| 10682523 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung | 2020-06-16 |
| 10680027 | Stacked semiconductor dies with a conductive feature passing through a passivation layer | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2020-06-09 |
| 10672819 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung | 2020-06-02 |
| 10629592 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2020-04-21 |
| 10622394 | Image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Ching-Chun Wang, Dun-Nian Yaung | 2020-04-14 |
| 10566378 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Dun-Nian Yaung, Wen-De Wang, Hsiao-Hui Tseng | 2020-02-18 |
| 10566288 | Structure for standard logic performance improvement having a back-side through-substrate-via | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2020-02-18 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2020-01-14 |