Issued Patents 2020
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879297 | Image sensor device and method of forming same | Wen-De Wang, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin | 2020-12-29 |
| 10868071 | Method for forming semiconductor image sensor | Jhy-Jyi Sze, Yimin Huang | 2020-12-15 |
| 10867891 | Ion through-substrate via | Yu-Yang Shen, Chien-Hsien Tseng, Nai-Wen Cheng, Pao-Tung Chen | 2020-12-15 |
| 10861899 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-12-08 |
| 10861894 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-12-08 |
| 10833119 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Jeng-Shyan Lin, Shyh-Fann Ting | 2020-11-10 |
| 10825853 | Semiconductor image sensor device with deep trench isolations and method for manufacturing the same | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Sheng-Chan Li, Yu-Jen Wang +3 more | 2020-11-03 |
| 10811398 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Jen-Cheng Liu, Hsing-Chih Lin, Ching-Chun Wang | 2020-10-20 |
| 10804155 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-10-13 |
| 10797091 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Feng-Chi Hung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2020-10-06 |
| 10790265 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Jen-Cheng Liu, Jeng-Shyan Lin, Hsun-Ying Huang | 2020-09-29 |
| 10790327 | Semiconductor device structure with a conductive feature passing through a passivation layer | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2020-09-29 |
| 10790194 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-09-29 |
| 10777590 | Method for forming image sensor device structure with doping layer in light-sensing region | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Yu-Jen Wang, Shyh-Fann Ting +2 more | 2020-09-15 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Shu-Ting Tsai, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2020-09-01 |
| 10734423 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2020-08-04 |
| 10734428 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung | 2020-08-04 |
| 10727164 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2020-07-28 |
| 10727265 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-07-28 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2020-07-28 |
| 10692914 | Implant damage free image sensor and method of the same | Alexander Kalnitsky, Jhy-Jyi Sze, Chen-Jong Wang, Yimin Huang, Yuichiro Yamashita | 2020-06-23 |
| 10682523 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-16 |
| 10680027 | Stacked semiconductor dies with a conductive feature passing through a passivation layer | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2020-06-09 |
| 10672819 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-02 |
| 10629568 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Ying-Ling Tsai | 2020-04-21 |