Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804155 | Inductor structure for integrated circuit | Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-10-13 |
| 10790194 | Inductor structure for integrated circuit | Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-09-29 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more | 2020-07-28 |
| 10714488 | Using three or more masks to define contact-line-blocking components in FinFET SRAM fabrication | Chih-Hung Hsieh | 2020-07-14 |
| 10535668 | Using three or more masks to define contact-line-blocking components in FinFET SRAM fabrication | Chih-Hung Hsieh | 2020-01-14 |