Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811398 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang | 2020-10-20 |
| 10804155 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao | 2020-10-13 |
| 10790194 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao | 2020-09-29 |
| 10727164 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Ching-Chun Wang, Kuan-Chieh Huang +1 more | 2020-07-28 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Min-Feng Kao +3 more | 2020-07-28 |
| 10629592 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2020-04-21 |