Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868050 | Backside illuminated image sensor with negatively charged layer | Shyh-Fann Ting, Chih-Yu Lai, Cheng-Ta Wu, Yeur-Luen Tu | 2020-12-15 |
| 10861894 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-12-08 |
| 10833119 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting | 2020-11-10 |
| 10811398 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsing-Chih Lin | 2020-10-20 |
| 10804155 | Inductor structure for integrated circuit | Shih-Han Huang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-10-13 |
| 10790194 | Inductor structure for integrated circuit | Shih-Han Huang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao | 2020-09-29 |
| 10727265 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-07-28 |
| 10727205 | Hybrid bonding technology for stacking integrated circuits | Kuo-Ming Wu, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao +3 more | 2020-07-28 |
| 10727164 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2020-07-28 |
| 10622394 | Image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Jen-Cheng Liu, Dun-Nian Yaung | 2020-04-14 |
| 10566374 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung | 2020-02-18 |