Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879297 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang | 2020-12-29 |
| 10833119 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Shyh-Fann Ting | 2020-11-10 |
| 10790265 | Semiconductor device structure with back-side layer to reduce leakage | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Hsun-Ying Huang | 2020-09-29 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2020-09-01 |
| 10682523 | Interconnect structure and method of forming same | Shu-Ting Tsai, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-16 |
| 10672819 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung | 2020-06-02 |
| 10629568 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Wen-I Hsu, Feng-Chi Hung, Dun-Nian Yaung, Ying-Ling Tsai | 2020-04-21 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2020-01-14 |