Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777539 | Seal-ring structure for stacking integrated circuits | Yi-Shin Chu, Kuan-Chieh Huang, Pao-Tung Chen, Yi-Hao Chen, Feng-Kuei Chang | 2020-09-15 |
| 10566378 | Back side illuminated image sensor with reduced sidewall-induced leakage | Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2020-02-18 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Yueh-Chiou Lin | 2020-01-14 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung +3 more | 2020-01-14 |