Issued Patents 2020
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861899 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-12-08 |
| 10861894 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-12-08 |
| 10797091 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2020-10-06 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Shih Pei Chou +2 more | 2020-09-01 |
| 10734428 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Jen-Cheng Liu, Dun-Nian Yaung | 2020-08-04 |
| 10727265 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2020-07-28 |
| 10682523 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu | 2020-06-16 |
| 10672819 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu | 2020-06-02 |
| 10629568 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Dun-Nian Yaung, Ying-Ling Tsai | 2020-04-21 |
| 10622394 | Image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Ching-Chun Wang, Jen-Cheng Liu, Dun-Nian Yaung | 2020-04-14 |
| 10566374 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung | 2020-02-18 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Shuang-Ji Tsai +3 more | 2020-01-14 |
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Jen-Cheng Liu, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-01-14 |