Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872918 | Optical isolation structure for reducing crosstalk between pixels and fabrication method thereof | Po-Han Huang, Tzu-Hsiang Chen, Jiech-Fun Lu | 2020-12-22 |
| 10868067 | Image sensor device and manufacturing method for improving shutter efficiency | Tsun-Kai Tsao, Jiech-Fun Lu | 2020-12-15 |
| 10868065 | Front side illuminated image sensor device structure and method for forming the same | Tsun-Kai Tsao, Jiech-Fun Lu | 2020-12-15 |
| 10840287 | 3DIC interconnect apparatus and method | Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai +4 more | 2020-11-17 |
| 10818720 | Stacked image sensor having a barrier layer | U-Ting Chen, Shu-Ting Tsai, Cheng-Ying Ho, Tzu-Hsuan Hsu | 2020-10-27 |
| 10804315 | Absorption enhancement structure for image sensor | Ching-Chung Su, Hung-Wen Hsu, Jiech-Fun Lu | 2020-10-13 |
| 10763292 | Interconnect apparatus and method for a stacked semiconductor device | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +2 more | 2020-09-01 |
| 10665456 | Semiconductor structure | Chen-Fa Lu, Jiech-Fun Lu, Yeur-Luen Tu, Chia-Shiung Tsai | 2020-05-26 |
| 10658474 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuo-Hwa Tzeng, Yu-Hung Cheng +1 more | 2020-05-19 |
| 10553474 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Yu-Hung Cheng +1 more | 2020-02-04 |
| 10529761 | Image sensor device and manufacturing method for improving shutter efficiency | Tsun-Kai Tsao, Jiech-Fun Lu | 2020-01-07 |