Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847564 | Charge release layer to remove charge carriers from dielectric grid structures in image sensors | Jiech-Fun Lu | 2020-11-24 |
| 10840287 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Chun-Han Tsao, Chia-Chieh Lin, Shu-Ting Tsai +4 more | 2020-11-17 |
| 10804315 | Absorption enhancement structure for image sensor | Hung-Wen Hsu, Jiech-Fun Lu, Shih Pei Chou | 2020-10-13 |
| 10784150 | Semiconductor structure and manufacturing method thereof | Jiech-Fun Lu, Jian Wu, Che-Hsiang Hsueh, Ming-Chi Wu, Chi-Yuan Wen +2 more | 2020-09-22 |