Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867891 | Ion through-substrate via | Yu-Yang Shen, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng | 2020-12-15 |
| 10790240 | Metal line design for hybrid-bonding application | Kuo-Ming Wu, Kuan-Liang Liu | 2020-09-29 |
| 10777539 | Seal-ring structure for stacking integrated circuits | Yi-Shin Chu, Kuan-Chieh Huang, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang | 2020-09-15 |