Issued Patents 2020
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629592 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2020-04-21 |
| 10622394 | Image sensing device | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Ching-Chun Wang, Jen-Cheng Liu | 2020-04-14 |
| 10566374 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung | 2020-02-18 |
| 10566378 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2020-02-18 |
| 10566288 | Structure for standard logic performance improvement having a back-side through-substrate-via | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2020-02-18 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2020-01-14 |
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-01-14 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2020-01-14 |