Issued Patents 2020
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-01-14 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2020-01-14 |