Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790189 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Yeur-Luen Tu +2 more | 2020-09-29 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh +2 more | 2020-05-26 |