Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10781098 | Method of manufacturing semiconductor structure | Ping-Yin Liu, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2020-09-22 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2020-05-26 |