Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10870574 | Method and apparatus for reducing in-process and in-use stiction for MEMS devices | Lee-Chuan Tseng, Chang-Ming Wu, Shih-Chang Liu | 2020-12-22 |
| 10865103 | Packaging method and associated packaging structure | Chih-Ming Chen, Chung-Yi Yu | 2020-12-15 |
| 10787360 | Semiconductor MEMS structure | Hsing-Lien Lin, Jung-Huei Peng, Yi-Chien Wu | 2020-09-29 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Lan-Lin Chao +2 more | 2020-05-26 |