Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790189 | 3D integrated circuit and methods of forming the same | Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Lan-Lin Chao, Yeur-Luen Tu +2 more | 2020-09-29 |
| 10781098 | Method of manufacturing semiconductor structure | Hung-Hua Lin, Kuan-Liang Liu, Chia-Shiung Tsai, Alexander Kalnitsky | 2020-09-22 |
| 10665449 | Integrate rinse module in hybrid bonding platform | Xin-Hua Huang, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2020-05-26 |
| 10636688 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Yeong-Jyh Lin, Yeur-Luen Tu | 2020-04-28 |
| 10622342 | Stacked LED structure and associated manufacturing method | Yeong-Jyh Lin, Chi-Ming Chen | 2020-04-14 |