Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10865103 | Packaging method and associated packaging structure | Chih-Ming Chen, Yuan-Chih Hsieh | 2020-12-15 |
| 10867792 | High electron mobility transistor (HEMT) having an indium-containing layer and method of manufacturing the same | Po-Chun Liu, Chi-Ming Chen, Min-Chang Ching, Chen-Hao Chiang, Chung-Chieh Hsu | 2020-12-15 |
| 10861896 | Capping structure to reduce dark current in image sensors | Po-Chun Liu, Eugene Chen | 2020-12-08 |
| 10833026 | Integrated circuit with backside structures to reduce substrate warp | Chih-Ming Chen, Szu-Yu Wang | 2020-11-10 |
| 10804101 | Semiconductor structure having sets of III-V compound layers and method of forming | Chi-Ming Chen, Po-Chun Liu, Chia-Shiung Tsai | 2020-10-13 |
| 10777649 | Silicon nano-tip thin film for flash memory cells | Tsu-Hui Su, Chih-Ming Chen, Chia-Shiung Tsai, Szu-Yu Wang | 2020-09-15 |