Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879197 | Package structure and method of fabricating package structure | Albert Wan, Chung-Shi Liu, Han-Ping Pu, Chien Ling Hwang | 2020-12-29 |
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chen-Hua Yu, Chung-Shi Liu, Han-Ping Pu, Hsin-Yu Pan +1 more | 2020-12-22 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Albert Wan, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2020-12-15 |
| 10867929 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Sung-Feng Yeh | 2020-12-15 |
| 10867940 | Package structure and manufacturing method thereof | Albert Wan, Shou-Zen Chang, Nan-Chin Chuang | 2020-12-15 |
| 10867966 | Package structure, package-on-package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2020-12-15 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Han-Ping Pu +5 more | 2020-08-25 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2020-08-11 |
| 10720495 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Hung-Yi Kuo, Chia-Chun Miao | 2020-07-21 |
| 10636713 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2020-04-28 |
| 10535913 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang | 2020-01-14 |