Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2020-12-15 |
| 10761385 | Liquid crystal on silicon panel having less diffraction | Ming Zhang, Libo Weng, Cheng Zhao, Yin Qian, Zhiqiang Lin +1 more | 2020-09-01 |
| 10720495 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Chao-Wen Shih, Hung-Yi Kuo | 2020-07-21 |