Issued Patents 2020
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Ming-Che Ho, Wei-Yu Chen +8 more | 2020-12-15 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |
| 10867952 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu | 2020-12-15 |
| 10825773 | Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same | Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu | 2020-11-03 |
| 10770313 | Integrated fan-out package and manufacturing method thereof | Chung-Hao Tsai, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2020-09-08 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Hsin-Yu Pan, Yi-Che Chiang | 2020-08-18 |
| 10748861 | Package structure and manufacturing method thereof | Han-Ping Pu, Yen-Ping Wang | 2020-08-18 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2020-07-28 |
| 10720399 | Semicondcutor package and manufacturing method of semicondcutor package | Fang-Yu Liang, Ching-Feng Yang | 2020-07-21 |
| 10707173 | Package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2020-07-07 |
| 10692832 | Manufacturing method of semiconductor structure | Chun-Lin Lu | 2020-06-23 |
| 10665537 | Package structure and manufacturing method thereof | Chien Ling Hwang, Chun-Lin Lu | 2020-05-26 |
| 10663633 | Aperture design and methods thereof | Hung-Chih Hsieh, Yen-Liang Chen, Kai-Hsiung Chen, Po-Chung Cheng, Chih-Ming Ke | 2020-05-26 |
| 10629539 | Package structure and method of fabricating the same | Fang-Yu Liang | 2020-04-21 |
| 10622222 | Integrated fan-out package having multi-band antenna and method of forming the same | Nan-Chin Chuang, Ching-Feng Yang | 2020-04-14 |
| 10553533 | Integrated fan-out package and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Nan-Chin Chuang | 2020-02-04 |
| 10553561 | Mechanisms of forming connectors for package on package | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng | 2020-02-04 |
| 10529666 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu | 2020-01-07 |