Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720399 | Semicondcutor package and manufacturing method of semicondcutor package | Ching-Feng Yang, Kai-Chiang Wu | 2020-07-21 |
| 10629539 | Package structure and method of fabricating the same | Kai-Chiang Wu | 2020-04-21 |