Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2020-12-15 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2020-08-18 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Vincent Chen, Chuei-Tang Wang +3 more | 2020-07-28 |
| 10720399 | Semicondcutor package and manufacturing method of semicondcutor package | Fang-Yu Liang, Kai-Chiang Wu | 2020-07-21 |
| 10622222 | Integrated fan-out package having multi-band antenna and method of forming the same | Nan-Chin Chuang, Kai-Chiang Wu | 2020-04-14 |