Issued Patents 2020
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Han-Ping Pu +1 more | 2020-12-22 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Albert Wan, Chao-Wen Shih, Han-Ping Pu, Sen-Kuei Hsu | 2020-12-15 |
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Chen-Hua Yu | 2020-12-15 |
| 10840197 | Package structure and manufacturing method thereof | Sen-Kuei Hsu | 2020-11-17 |
| 10818651 | Package structure | Sen-Kuei Hsu, Ming-Hsien Tsai | 2020-10-27 |
| 10818588 | Semiconductor device, package structure and method of fabricating the same | Sen-Kuei Hsu, Yi-Che Chiang | 2020-10-27 |
| 10811384 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-10-20 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Kai-Chiang Wu, Yi-Che Chiang | 2020-08-18 |
| 10720416 | Semiconductor package including thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2020-07-21 |
| 10672681 | Semiconductor packages | Chien-Chang Lin, Lipu Kris Chuang, Ming-Chang Lu | 2020-06-02 |