Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818588 | Semiconductor device, package structure and method of fabricating the same | Sen-Kuei Hsu, Hsin-Yu Pan | 2020-10-27 |
| 10748831 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu | 2020-08-18 |