Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867878 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Chien Ling Hwang, Hsin-Yu Pan, Chen-Hua Yu | 2020-12-15 |
| 10867949 | Substrate design for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu | 2020-12-15 |
| 10818614 | Package structure | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou | 2020-10-27 |
| 10714359 | Substrate design for semiconductor packages and method of forming same | Tsung-Ding Wang, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu | 2020-07-14 |