Issued Patents 2020
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861823 | Dual-sided integrated fan-out package | Kuo Lung Pan, Wei Sen Chang, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-08 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2020-11-24 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2020-11-17 |
| 10833033 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Chen-Shien Chen, Yen-Liang Lin | 2020-11-10 |
| 10825696 | Cross-wafer RDLs in constructed wafers | Chen-Hua Yu | 2020-11-03 |
| 10811338 | Surface treatment method and apparatus for semiconductor packaging | Chih-Horng Chang, Jie Deng, Ying-Yu Chen | 2020-10-20 |
| 10811384 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2020-10-20 |
| 10797008 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2020-10-06 |
| 10790269 | Semiconductor devices and semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2020-09-29 |
| 10784203 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang +1 more | 2020-09-22 |
| 10734347 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Chita Chuang, Chen-Shien Chen | 2020-08-04 |
| 10734328 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Ching-Yao Lin, Teng-Yuan Lo, Chih-Lin Wang | 2020-08-04 |
| 10720416 | Semiconductor package including thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2020-07-21 |
| 10700008 | Package structure having redistribution layer structures | Chih-Hao Chang, Hao-Yi Tsai, Tsung-Hsien Chiang | 2020-06-30 |
| 10658258 | Chip package and method of forming the same | Kuo Lung Pan, Hao-Yi Tsai | 2020-05-19 |
| 10643943 | Package structure, package-on-package structure and manufacturing method thereof | Chuei-Tang Wang | 2020-05-05 |