Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867911 | InFO coil structure and methods of manufacturing same | Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2020-12-15 |
| 10832985 | Sensor package and method | Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2020-11-10 |
| 10784203 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tin-Hao Kuo +1 more | 2020-09-22 |
| 10700008 | Package structure having redistribution layer structures | Chih-Hao Chang, Hao-Yi Tsai, Tin-Hao Kuo | 2020-06-30 |