Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861841 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai +2 more | 2020-12-08 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai +5 more | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ying-Cheng Tseng +5 more | 2020-11-10 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2020-05-19 |