Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen +8 more | 2020-12-15 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2020-11-17 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10784221 | Method of processing solder bump by vacuum annealing | Chung-Shi Liu, Ming-Da Cheng, Chung-Cheng Lin, Yu-Peng Tsai, Cheng-Ting Chen | 2020-09-22 |
| 10784203 | Semiconductor package and method | Tzu-Sung Huang, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2020-09-22 |
| 10734263 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-08-04 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658323 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-05-19 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2020-01-14 |