Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10784221 | Method of processing solder bump by vacuum annealing | Hsiu-Jen Lin, Chung-Shi Liu, Ming-Da Cheng, Chung-Cheng Lin, Yu-Peng Tsai | 2020-09-22 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Chia-Lun Chang +4 more | 2020-02-18 |
| 10534353 | System and method to reduce pre-back-grinding process defects | Chen-Fa Lu, James Hu, Chung-Shi Liu | 2020-01-14 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2020-01-14 |