Issued Patents 2020
Showing 25 most recent of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879224 | Package structure, die and method of manufacturing the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-29 |
| 10877777 | Enabling virtual calls in a SIMD environment | Guei-Yuan Lueh, Subramaniam Maiyuran | 2020-12-29 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho +8 more | 2020-12-15 |
| 10854565 | Chip package structure with bump | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen | 2020-12-01 |
| 10852513 | Photographing optical lens system, image capturing unit and electronic device | Tzu-Chieh KUO | 2020-12-01 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng | 2020-11-17 |
| 10839478 | Accumulator pooling mechanism | Guei-Yuan Lueh, Subramaniam Maiyuran, Konrad Trifunovic, Supratim Pal, Chandra Gurram +3 more | 2020-11-17 |
| 10838173 | Photographing lens assembly, imaging apparatus and electronic device | Chun-Che Hsueh, Chun-Yen Chen | 2020-11-17 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2020-10-20 |
| 10812505 | System and detecting and defending method for edge network | Li-Der Chou, Chia-Wei Tseng, Chia-Kuan Yen, Wei-Hsiang Tsai, Tsung-Fu Ou +2 more | 2020-10-20 |
| D898599 | Device for receiving and transmitting information data and sending out light and sound for warnings | — | 2020-10-13 |
| 10796927 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su | 2020-10-06 |
| 10795119 | Imaging optical lens assembly, imaging apparatus and electronic device | Chun-Yen Chen, Po-Lun Hsu | 2020-10-06 |
| 10795128 | Image capturing optical lens assembly, image capturing device and electronic device | Tung-Yi Hsieh | 2020-10-06 |
| 10796667 | Register spill/fill using shared local memory space | Joydeep Ray, Altug Koker, Balaji Vembu, Murali Ramadoss, Guei-Yuan Lueh +7 more | 2020-10-06 |
| 10788650 | Optical lens assembly, image capturing apparatus and electronic device | — | 2020-09-29 |
| 10790261 | Bonding through multi-shot laser reflow | Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2020-09-29 |
| 10782506 | Optical imaging lens assembly, image capturing unit and electronic device | Chien-Hsun Wu, Chun-Che Hsueh | 2020-09-22 |
| 10777430 | Photonic integrated package and method forming same | Chen-Hua Yu, An-Jhih Su | 2020-09-15 |
| 10769080 | Distributed and shared memory controller | Hao Luan, Alan Gatherer, Xi Chen, Fang Yu, Yichuan Yu +1 more | 2020-09-08 |
| 10754651 | Register bank conflict reduction for multi-threaded processor | Chandra Gurram, Subramaniam Maiyuran, Buqi Cheng, Ashutosh Garg, Guei-Yuan Lueh | 2020-08-25 |
| 10756025 | Semiconductor package device and method of manufacturing the same | Wei-Hsuan Lee, Jaw-Ming Ding | 2020-08-25 |
| 10750069 | Optical image capturing system, image capturing device and electronic device | Lin-Yao Liao, Dung-Yi Hsieh | 2020-08-18 |
| 10734357 | Chip package structure with molding layer | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen | 2020-08-04 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin +1 more | 2020-07-21 |