Issued Patents 2020
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879224 | Package structure, die and method of manufacturing the same | Wei-Yu Chen, An-Jhih Su, Hua-Wei Tseng, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-29 |
| 10872865 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2020-12-22 |
| 10872855 | Chip package and method of fabricating the same | Guan-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-22 |
| 10867928 | Semiconductor device and manufacturing method thereof | Kuan-Chung Lu, An-Jhih Su, Li-Hsien Huang, Yueh-Ting Lin, Ming-Shih Yeh | 2020-12-15 |
| 10867900 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Li-Han Hsu +1 more | 2020-12-15 |
| 10847383 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2020-11-24 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10811389 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2020-10-20 |
| 10796927 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, An-Jhih Su, Wei-Yu Chen | 2020-10-06 |
| 10797038 | Semiconductor package and rework process for the same | Chen-Hua Yu, An-Jhih Su, Shing-Chao Chen, Ching-Hua Hsieh, Chung-Shi Liu +1 more | 2020-10-06 |
| 10784207 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Wei-Cheng Wu | 2020-09-22 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, An-Jhih Su, Hua-Wei Tseng, Yueh-Ting Lin, Ming-Shih Yeh | 2020-08-25 |
| 10741512 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Hsien-Wei Chen, Jie Chen | 2020-08-11 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-07-21 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +2 more | 2020-07-14 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Wei-Cheng Wu | 2020-06-30 |
| 10700032 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Li-Hsien Huang | 2020-06-30 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Hsien-Wei Chen, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-06-02 |
| 10672738 | Package structures and methods of forming | Chen-Hua Yu, Hsien-Wei Chen | 2020-06-02 |
| 10672647 | Wafer level chip scale packaging intermediate structure apparatus and method | Chen-Hua Yu | 2020-06-02 |
| 10665540 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Chen-Hua Yu | 2020-05-26 |
| 10665468 | Multi-chip structure and method of forming same | Chen-Hua Yu | 2020-05-26 |
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, An-Jhih Su | 2020-05-19 |
| 10643864 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Hsien-Wei Chen, Wei-Yu Chen | 2020-05-05 |
| 10643965 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu | 2020-05-05 |