Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867928 | Semiconductor device and manufacturing method thereof | Kuan-Chung Lu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2020-12-15 |
| 10756037 | Package structure and fabricating method thereof | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Shih Yeh | 2020-08-25 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Wei-Yu Chen +1 more | 2020-07-21 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Hsien Huang, Wei-Yu Chen +1 more | 2020-06-02 |