Issued Patents 2020
Showing 1–25 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879138 | Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same | Ching-Jung Yang, Jie Chen | 2020-12-29 |
| 10879198 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2020-12-29 |
| 10872865 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2020-12-22 |
| 10867968 | 3DIC structure with protective structure and method of fabricating the same | Ching-Jung Yang, Ming-Fa Chen | 2020-12-15 |
| 10867879 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2020-12-15 |
| 10867896 | Molding compound structure | — | 2020-12-15 |
| 10867967 | Chip package with redistribution layers | Jie Chen | 2020-12-15 |
| 10867966 | Package structure, package-on-package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2020-12-15 |
| 10867900 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2020-12-15 |
| 10861808 | Bonding structure of dies with dangling bonds | Ming-Fa Chen, Chih-Chia Hu | 2020-12-08 |
| 10854565 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2020-12-01 |
| 10854574 | Forming metal bonds with recesses | Ming-Fa Chen, Sung-Feng Yeh, Wen-Chih Chiou | 2020-12-01 |
| 10847383 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2020-11-24 |
| 10840190 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Ming-Fa Chen | 2020-11-17 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2020-11-17 |
| 10833030 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2020-11-10 |
| 10833031 | Pad design for reliability enhancement in packages | — | 2020-11-10 |
| 10825804 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2020-11-03 |
| 10825780 | Semiconductor device with electromagnetic interference protection and method of manufacture | Chi-Hsi Wu, Li-Hsien Huang, Tien-Chung Yang | 2020-11-03 |
| 10818624 | Semiconductor structure and method for manufacturing the same | Ming-Fa Chen | 2020-10-27 |
| 10818615 | Semiconductor structure | Ying-Ju Chen, Ming-Fa Chen | 2020-10-27 |
| 10811390 | Die stack structure and method of fabricating the same and package | Jie Chen, Ming-Fa Chen | 2020-10-20 |
| 10811389 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2020-10-20 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10811369 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2020-10-20 |