Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879198 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2020-12-29 |
| 10854564 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2020-12-01 |
| 10854580 | Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof | Wei-Heng Lin, Chih-Hang Tung, Chen-Hua Yu | 2020-12-01 |
| 10825804 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2020-11-03 |
| 10734348 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Chih-Hang Tung | 2020-08-04 |