Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879198 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Yu-Chia Lai, Tung-Liang Shao | 2020-12-29 |
| 10854564 | Semiconductor device and manufacturing method thereof | Tung-Liang Shao, Yu-Chia Lai, Hsien-Ming Tu, Ching-Jung Yang | 2020-12-01 |
| 10825804 | Hollow metal pillar packaging scheme | Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2020-11-03 |