Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854580 | Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof | Wei-Heng Lin, Tung-Liang Shao, Chen-Hua Yu | 2020-12-01 |
| 10734279 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chen-Hua Yu | 2020-08-04 |
| 10734348 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Tung-Liang Shao | 2020-08-04 |
| 10714457 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2020-07-14 |