Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879343 | Semiconductor arrangement and method of making | Huan-Neng Chen | 2020-12-29 |
| 10770414 | Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure | Huan-Neng Chen | 2020-09-08 |
| 10734279 | Semiconductor package device with integrated antenna and manufacturing method thereof | Feng-Wei Kuo, Chih-Hang Tung, Chen-Hua Yu | 2020-08-04 |
| 10665536 | 3D IC Decoupling capacitor structure and method for manufacturing the same | Chewn-Pu Jou | 2020-05-26 |
| 10665554 | Magnetic structure for transmission lines in a package system | Huan-Neng Chen | 2020-05-26 |
| 10651053 | Embedded metal insulator metal structure | Chewn-Pu Jou | 2020-05-12 |