Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861808 | Bonding structure of dies with dangling bonds | Hsien-Wei Chen, Ming-Fa Chen | 2020-12-08 |
| 10784219 | Semiconductor device and method of manufacturing | Ching-Pin Yuan, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2020-09-22 |
| 10741506 | Seal ring for hybrid-bond | Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen, Hsien-Wei Chen | 2020-08-11 |
| 10620530 | Multiple-mask multiple-exposure lithography and masks | Peter Yu, Chih-Tung Hsu, Kevin Wang, Roger Chen | 2020-04-14 |
| 10535636 | Integrating passive devices in package structures | Ming-Fa Chen | 2020-01-14 |