Issued Patents 2020
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872836 | Package structure for heat dissipation | Chen-Hua Yu, Ming-Fa Chen | 2020-12-22 |
| 10867966 | Package structure, package-on-package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen, Chao-Wen Shih | 2020-12-15 |
| 10867929 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Chao-Wen Shih | 2020-12-15 |
| 10867879 | Integrated circuit package and method | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-12-15 |
| 10854574 | Forming metal bonds with recesses | Ming-Fa Chen, Hsien-Wei Chen, Wen-Chih Chiou | 2020-12-01 |
| 10840217 | Stacked chip package and methods of manufacture thereof | Chen-Hua Yu, Ming-Fa Chen | 2020-11-17 |
| 10797015 | Method of manufacturing 3DIC structure | Hsien-Wei Chen, Ming-Fa Chen | 2020-10-06 |
| 10784219 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Ching-Pin Yuan, Sen-Bor Jan, Ming-Fa Chen | 2020-09-22 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2020-08-25 |
| 10685910 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen | 2020-06-16 |
| 10685935 | Forming metal bonds with recesses | Ming-Fa Chen, Hsien-Wei Chen, Wen-Chih Chiou | 2020-06-16 |
| 10685911 | Semiconductor package and manufacturing method of the same | Ming-Fa Chen, Chen-Hua Yu | 2020-06-16 |
| 10672754 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Chi-Hwang Tai | 2020-06-02 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu, Ching-Pin Yuan | 2020-06-02 |
| 10658333 | Package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen | 2020-05-19 |
| 10622327 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Ming-Fa Chen | 2020-04-14 |
| 10541227 | System on integrated chips and methods of forming same | Chen-Hua Yu, Ming-Fa Chen | 2020-01-21 |
| 10535631 | 3D Chip-on-wager-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai | 2020-01-14 |