Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Ching-Pin Yuan | 2020-06-02 |