Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784219 | Semiconductor device and method of manufacturing | Chih-Chia Hu, Sung-Feng Yeh, Sen-Bor Jan, Ming-Fa Chen | 2020-09-22 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui Liu | 2020-06-02 |