Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672754 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2020-06-02 |
CT
Chi-Hwang Tai
Overall (2020): #511,794 of 565,922Top 95%
1
Patents 2020