Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10535631 | 3D Chip-on-wager-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh | 2020-01-14 |
WT
Wen-Ching Tsai
Overall (2020): #227,434 of 565,922Top 45%
1
Patents 2020