Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867879 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2020-12-15 |
| 10867929 | Semiconductor structures and methods of forming the same | Chen-Hua Yu, Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh | 2020-12-15 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2020-08-25 |
| 10734295 | Interposer test structures and methods | Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2020-08-04 |