Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Jing-Cheng Lin, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2020-08-04 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2020-05-26 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2020-05-26 |
| 10535633 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Shang-Yun Hou | 2020-01-14 |