Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665474 | 3D packages and methods for forming the same | Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2020-05-26 |
TC
Tzu-Wei Chiu
Overall (2020): #236,629 of 565,922Top 45%
1
Patents 2020